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Myfab

Realise your nano vision

Resources

 All tools

Resources at your disposal
The Electrum Laboratory maintains a multitude of laboratories, covering most aspects of nano and microtechnology. In our flexible facilities both single samples and batches are equally welcome. We handle separate steps to full sequences in fabrication and characterization. We offer access to sophisticated software for calculation and simulation. Our personnel are available to help you to master the wide world of nano and microtechnology.
 
Full process lines and characterization resources
In our cleanroom we maintain full process lines for Silicon CMOS, MEMS and compound semiconductors, including GaAs, InP and SiC. We also offer access to a wide variety of techniques for characterization of materials and devices.
 
 
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 NameManufacturerModelCategory
DetailsRinser 2VerteqVerteqWet process benches
DetailsGammaSuss MicrotecGamma 4MLithography
DetailsBake 7MemmertUM 100 bakeLithography
DetailsFH APL-gulPM PlastDragskåpLithography
DetailsRoomRElabresponsibleOther processes
DetailsTencorTencorSurface profiler Tencor-P10Metrology
DetailsGeminiZeiss Ultra 55Surface analysis & TEM
DetailsB5-BoronBruce BDF4Diffusion-boron doping SiliconThermal processes
DetailsB6-FGABruce BDF4Diffusion-Forming gas anneal SiliconThermal processes
DetailsB8-Wet-DryBruce BDF4Diffusion-Wet oxidation SiliconThermal processes
DetailsC2-DryBruce BDF4Diffusion-Dry oxidation SiliconThermal processes
DetailsC3-Wet-DryBruce BDF4Diffusion-Wet oxidation SiliconThermal processes
DetailsC4-G-FGABruce BDF4Diffusion-Forming gas anneal Silicon (gold)Thermal processes
DetailsALOESSTSICP AOE (DRIE)Dry etching
DetailsICPSTSICP DRIE (Si, SiO2)Dry etching
DetailsP5000Applied MaterialsPrecision 5000 Mark II (Dielectric, MxP, CVD)Dry etching
DetailsRTAMattson100 RTP SystemsThermal processes
DetailsBonderKarl SussCB8 Substrate BonderDevice mounting
DetailsKarl SussKarl SussMask aligner MA8/BA8Lithography
DetailsSabinaSSESpinner model Primus SB15Lithography
DetailsXLS-StepperXLS7500/2145 i-line stepperLithography
DetailsYes-ugnYESPolyimide Bake Oven YES-450PB8-2/6-2Thermal processes
DetailsDisco-sawDiscoDFD640 Sawing
DetailsA1-NITRIDEBruceLPCVD furnaceThin film deposition
DetailsA2-LTO-IDPBruceLPCVD furnaceThin film deposition
DetailsA3-TEOSBruceLPCVD TEOSThin film deposition
DetailsSputterElectrotechMS6200.Thin film deposition
DetailsSTSSTSPECVDThin film deposition
DetailsR/D CleanHmabridge Ltd4"-8", No metalsWet process benches
DetailsHR X-RayX-RayX-RayMetrology
DetailsNiklasNikonNikon OPTISHOT 200/cameraMetrology
DetailsPL mappingPhilipsCQL7840/DMetrology
DetailsX-ray WilhelmX-ray defraction SimensD5000 Powder X-Ray DiffractometerMetrology
DetailsRenrumElabAccessOther processes
DetailsMyrslokenMyrslokMyrslokDevice mounting
DetailsMårtenMårtenMårtenDevice mounting
DetailsOrthodyneOrthodyne20 Large WirebonderDevice mounting
DetailsRakelDage Precima InternationalRakelDevice mounting
DetailsEsa(-Pekka)Oxford Plasma SystemPlasmalab80Plus (Oxford RIE System) Chamber BDry etching
DetailsFabioOxford InstrumentICP380 Etch SystemDry etching
DetailsGallusOxford InstrumentICP380 Etch System (GaAs & InP)Dry etching
DetailsNikoNordiko3000 Ion beam system (CAIBE)Dry etching
DetailsTegalPlasmaline515 (RF Plasma Asher)Dry etching
DetailsTeplaTePla300 (Microwave Plasma Asher)Dry etching
DetailsDSW-StepperDSW8500/2035 g-line stepperLithography
DetailsEmmaKarl SussMA6/BA6Lithography
DetailsNilsEVG620 UV Nanoimprint LithographyLithography
DetailsAliceAlcatelSputter SystemThin film deposition
DetailsBarbaraProvacPAK 600 Coating SystemThin film deposition
DetailsIndiraBalzersBA 510 Thermal EvaporatorThin film deposition
DetailsZitaBalzersBAE 250 Coating SystemThin film deposition
DetailsBlästerGuyson Europlast4 SF-Select (med inställbar hjöd) samt utsugningsfOther processes
DetailsLäppusLogitech50 Precision Lapping & Polishing MachineOther processes
DetailsPekka (booking on Esa)Plasmalab80Plus (Oxford PECVD System) Chamber AThin film deposition
DetailsPeoPEOPEO-603 Anneal furnace III/V (ramp)Thermal processes
DetailsIBSCommonwealth Scientific CorporationIon Beam Sputtering ToolThin film deposition
DetailsKDFKDF844GTThin film deposition
DetailsFilippaSussMicrotecAutomatic Flip Chip Bonder FC150Device mounting
DetailsM01 OlympusOlympusBX60MSurface analysis & TEM
DetailsBalanceBalanceVågOther processes
DetailsM11 Nikon/CD 1NikonOPTISHOT/LinjebreddsmätareMetrology
DetailsM12 Nikon/CD 2NikonMikroskop/LinjebreddsmätareMetrology
DetailsLEITZLEITZ MPV-SPThin film interferometry, Metrology
DetailsWetb-diff-cleanWet bench CleanWet bench Clean and IMECWet process benches
DetailsW0607Wet bench HF cleanWet bench HF clean and HF dopedWet process benches
DetailsWetb Si processWet bench oxideWet bench oxide,HF 1:10,BHF,HFmixWet process benches
DetailsWetb Si stripWet bench developerPhotoresist processing.Wet process benches
DetailsW1718Wet benchWet benchWet process benches
DetailsWetb MEMSWet benchTMAH, HF, KOHWet process benches
DetailsWetb metalWet benchAu/metal etchWet process benches
DetailsWetb solventWet benchRemover, Vax, Au moduleWet process benches
DetailsWetb Au developWet benchWet benchWet process benches
DetailsPamelaSTS 308PC (RF Plasma Asher)Dry etching
DetailsEpsilon2000ASM200Si-epiEpitaxy
DetailsBake 2Bake oven DespatchPre and postprocessing of samplesLithography
DetailsBake 3Bake oven MemmertPre and postprocessing of samplesLithography
DetailsMasktvättUltra t Equipment Company, Inc.SCS 124Lithography
DetailsQuicksealQuicksealInplastningOther processes
DetailsSkivthkMitutoyoRDP transducer indicator E307-1Metrology
DetailsW2631Wet benchWet bench spray etch (GaAs).Wet process benches
DetailsW3233Wet benchWet bench lift off.Wet process benches
DetailsW34Wet benchWet bench LithografiWet process benches
DetailsAsterixAixtron AIX 200/4MovpeEpitaxy
DetailsMozartVeeco TurboDiscGaAs-MOVPE D180 LDMEpitaxy
DetailsObelixAixtronLP-VPE 2106Epitaxy
DetailsSemlanEpigress VP508/SK SiC-VPEEpitaxy
DetailsPlasmatvätt PicoDiener PICO RFLow pressure plasma etcherDry etching
DetailsArnoldSSE spincoaterOPTISPIN SST20Lithography
DetailsFH APLFume hoodFume hoodWet process benches
DetailsWetb SiCWet bench Substrate cleaningWet process benches
DetailsWetb APL-gulWet benchWet benchWet process benches
DetailsAPL-Tube 1Harmbridge Diffusion FurnaceNoble III Thermal oxidation - DiffusionThermal processes
DetailsRIEPlasmalab System 100RIE of thin films (Si3N4 & SiO2)Dry etching
DetailsDWLHeidelberg InstrumentsDirect Write Laser Lithography Tool 2.0Lithography
DetailsAPL-HMDSYES-5E Vacuum Bake / Vapour Prime Processing SystemLithography
DetailsM02 Olympus/cameraOlympusBX60Surface analysis & TEM
DetailsM03 LeicaLeicaMicroscopeSurface analysis & TEM
DetailsRinser 1VerteqVerteqWet process benches
DetailsUVO CleanerJelight COmpany, Inc42-220Sample prep
DetailsM04 LeitzLeitzLABORLUX 12 HLSurface analysis & TEM
DetailsM05 Nikon/autoNikonMicroscopeSurface analysis & TEM
DetailsHMDS 2IMTECStar 2000 (HMDS)Lithography
DetailsR/D doubleSemitoolSemitool Double 870SWet process benches
DetailsFH Gul3PM PlastDragskåpLithography
DetailsKyl & frysElectroluxKylskåp/frysOther processes
DetailsM07 Olympus/cameraOlympusMicroscopeSurface analysis & TEM
DetailsR/D 3VerteqVerteqWet process benches
DetailsM06 NikonNikonOPTISHOT / Polaroid cameraSurface analysis & TEM
DetailsFH III/VPM PlastDragskåpWet process benches
DetailsR/D Gul1FSI PhoenixFSI Phoenix 4"Wet process benches
DetailsPrometeus autoKarl Suss and Temptronic TermoChuck SystemAutomatic Probestation PA 150 and TP03215B-3300-2Metrology
DetailsAFM AcreoDigital Instruments (Veeco)Atomic Force MicroscopeMetrology
DetailsElliSENTECH Instruments GmbHEllipsometerMetrology
DetailsDektakSTDektak3STMetrology
DetailsBertilWest Bond 7476E-79 Manual Wedge-Wedge Wire BonderDevice mounting
DetailsM10 Nikon/autoNikonMicroscope (motorized objectives)Surface analysis & TEM
DetailsFTP500FTPInterferometerMetrology
DetailsPrometeus manualKarl Suss and Temptronic TermoChuck SystemManual Probestation PM 5, TP0314AMetrology
DetailsRörtvättKTHhandmadeOther processes
DetailsCenturaApplied MaterialsCentura II (DPS & MxP)Dry etching
DetailsGold sputterJEOLFine Coat Ion SputterSample prep
DetailsAPL-Tube 2Harmbridge Diffusion FurnaceNoble III Thermal oxidation - DiffusionThermal processes
DetailsAPL-Tube 3Harmbridge Diffusion FurnaceNoble III Metal sinteringThermal processes
DetailsAu platingNo nameNo nameOther processes
DetailsProbestation 1Cascade11000Metrology
DetailsProbestation 2HypervisionVisionary 2000Metrology
DetailsALS-stepperGCA/UltratechALS 2035 G-lineLithography
DetailsBall bonderF&K Delvotec Semiconductor GmbH5410Device mounting
DetailsKlimatkammare??Device mounting
DetailsAJA SputterAJA InternationalATC Orion-8Thin film deposition
DetailsFE-TEMJEOLJEM 2100F(HR), JEOL Electron Microscope 2100 FieldSurface analysis & TEM
DetailsFIB-SEMFEIQUANTA 3D FEG Surface analysis & TEM
DetailsBake 4MemmertU 26Lithography
DetailsBake 5MemmertU 26Thermal processes
DetailsBake 6MemmertULM 400Lithography
DetailsManual probstationSuss Microtech10500006 (probe station)Metrology
DetailsOptical profilometerVeecoWyko NT9300Metrology
DetailsAFM/SSRMVeeco/Digital InstrumentsNanoScope Dimension 3100Metrology
DetailsHallVarian/KeithlyIn-houseMetrology
DetailsAGMPrinceton Measurement Corporation2900-02 Alternating Gradient MagnetometerMetrology
DetailsR/D 2VerteqVerteq 4"Wet process benches
DetailsFH wet chemistry-1PM PlastDragskåp solvent (for service work)Wet process benches
DetailsR/D MetalsSemitoolSemitool 4" MetalsWet process benches
DetailsR/D GoldFSI PhoenixFSI Phoenix 4" Au/Lift-OffWet process benches
DetailsM13 Nikon/cameraNikonNikonSurface analysis & TEM
DetailsCanon EOS 350DCanonEOS 350D 100mm MacroSurface analysis & TEM
DetailsM08 Leitz/cameraLeitzMicroscope with cameraSurface analysis & TEM
DetailsM09 Nikon/cameraNikonMicrosocpe with cameraSurface analysis & TEM
DetailsMS01 NikonNikonStereo microscope SMZ-2BSurface analysis & TEM
DetailsKemvåg??Metrology
DetailsMS02 NikonNikonStereo microscope SMZ-2TSurface analysis & TEM
DetailsNapoleonAixtronVP508GFR SiC epiEpitaxy
DetailsTesttoolTest IncStandardOther processes
DetailsArielOxford Plasma TechnologyPlasmalab80Plus (Oxford RIE System)Dry etching
DetailsEdvardEdvards160Thin film deposition
DetailsMaximusSSEMaximus 804Lithography
DetailsFH wet chemistry-2PM PlastDragskåp solventWet process benches
DetailsFH wet chemistry-3PM PlastDragskåp solventWet process benches
DetailsFH wet chemistry-4PM PlastDragskåp solventWet process benches
DetailsFH wet chemistry-5PM PlastDragskåp solventWet process benches
DetailsFH wet chemistry-6PM PlastDragskåp solventWet process benches
DetailsManual spray coaterHome madev1Lithography
Details4-PointFour Dimensions, IncModel 280Metrology
Details3D MF ProbestationIn-houseMedium Field MR and RF Probe StationMetrology
DetailsHF ProbestationIn-houseHigh Field RF Characterization StationMetrology
DetailsCIPTSmartipCIPTechMetrology
DetailsMRCMaterial Research CorporationMRC 643Thin film deposition
DetailsProbestation 3Cascade MicrotechCascade 12000Metrology
DetailsNetwork AnalyzerAgilentPNA 110 GHzMetrology
DetailsLab supportELABVirtual toolOther processes
DetailsCritical Point DryerBaltecCPD 408Other processes
DetailsSQUID-VSMQuantum DesignUtlrasensitiv magnetometerMetrology
DetailsPreparation labCollection of toolsTools for sample preparationSurface analysis & TEM
DetailsLäcksökarenPfeiferQualyTest HLT260Other processes
DetailsFiber annealÅngpaneföreningenSpecial designOther processes
DetailsActivatorCentrothermActivator 150 (SiC anneal)Thermal processes
DetailsALDBENEQTFS200Thin film deposition
DetailsFH Gul1clanLAFVFR 1206 LAFLithography
DetailsMegasonic bathPCTPCT 24 wet benchWet process benches
DetailsAPL spinnerBLEBuilt inLithography
DetailsLIMSElabAccessOther processes
DetailsDisco DAD sawDiscoDAD 320Sawing
DetailsUVISELHORIBAUVISEL ERMetrology
DetailsElectroglasElectroglas2001XMetrology
DetailsCD SEMHitachiS-3400N & EDS QUANTAX 200Surface analysis & TEM
DetailsPlasma cleanerFischionePlasma cleanerSample prep
DetailsGold sputter FNMJEOLIon sputter JFC-1100Sample prep
DetailsDiamond sawBuehlerIsomet low speed sawSample prep
DetailsGrinder-polisherBuehlerVector/AlphaSample prep
DetailsUltrasonic disc cutterGatanModel 601Sample prep
DetailsDimple grinderGatanDimple grinderSample prep
DetailsElectrolyte polishingFischioneElectrolyte polishingSample prep
DetailsIon polishingGatanPrecision ion polishing 691Sample prep
DetailsM20 MicroscopeNanometricsMicroscopeSample prep
DetailsLaboratory ovenHereausBench ovenSample prep
DetailsEbeam litho AlbanovaRaith GmbHRaith 150 TKLithography
DetailsFIB/SEM AlbanovaFEI CompanyNova 200Surface analysis & TEM
DetailsSPM/AFM/STM AlbanovaBruker (formerly Veeco) Multimode Nanoscope IVMetrology
DetailsProfiler AlbanovaKLA-TencorP15Metrology
DetailsRIE ICP O2/AR AlbanovaOxfordPlasmalab 80+Dry etching
DetailsAJA Sputter AlbanovaAJA InternationalOrionThin film deposition
DetailsKarl Suss MJB3 AlbanovaKarl SussMJB3Lithography
DetailsEdwards Auto 306 AlbanovaEdwardsAuto306 with FL400 chamberThin film deposition
DetailsFH epi servicePM PlastDragskåp för epi rengöringWet process benches
DetailsWetb SabinaPM Plast2 HP, Developer, SinkWet process benches
DetailsFH wet chemistry-7PM PLastDragskåpWet process benches
DetailsFH wet chemistry-8PM PlastDragskåpWet process benches
DetailsM14 Olympus/cameraOlympusBX60Surface analysis & TEM
DetailsHorizon?4080XMetrology
DetailsR/D Replis 4"/8"??Wet process benches
DetailsOPT104??Metrology
DetailsT1-Oxide 1150CThermco5200Thermal processes
DetailsT2-Oxide 1250CThermco5200Thermal processes
DetailsT3-Gate oxThermco5200Thermal processes
DetailsT4-FGAThermco5200Thermal processes
DetailsEurovac UHV deposit, AlbanovaEurovac/ThermionicsCustom madeThin film deposition
DetailsCryo RIE AlbanovaOxfordPlasmalab 100Dry etching
DetailsSputnik AlbanovaThermionics + otherCustom madeThin film deposition
DetailsWire bonder AlbanovaKulicke - Soffa4523DDevice mounting
DetailsSPM/AFM Dim3100 AlbanovaVeeco (Digital Instruments)Dimension 3100Metrology
DetailsBond Tester DAGEDAGE2400PCMetrology
DetailsTLE labTanner15.10Other processes
DetailsPLDNeocera IncNeocera Pioneer 180 UHV PLDDevice mounting