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Electrum resources-Dice mounting

  Dice Mounting
 

Dice are sawn or cleaved from the substrates after completed processing. Mounting and forming of electrical contacts are made by soldering, wire bonding or flip chip bonding. 

 
 
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 NameManufacturerModel
DetailsBonderKarl SussCB8 Substrate Bonder
DetailsDisco-sawDiscoDFD640
DetailsOrthodyneOrthodyne20 Large Wirebonder
DetailsRakelDage Precima InternationalRakel
DetailsFilippaSussMicrotecAutomatic Flip Chip Bonder FC150
DetailsBertilWest Bond 7476E-79 Manual Wedge-Wedge Wire Bonder
DetailsBall bonderF&K Delvotec Semiconductor GmbH5410
DetailsDisco DAD sawDiscoDAD 320
DetailsWire bonder AlbanovaKulicke - Soffa4523D
DetailsFH MS OlympusLabrum klimatLAF
DetailsFH MS NikonLabrum klimatLAF