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Dry etching and metallization for Si-processes

An Applied Materials P5000 dry etcher (to the left) and

a MRC sputtering tool (to the right)

Chamber A:

etching of SiN and SiO2
Chamber B:
etching of Al, TiW, Al(Si,Cu) and TiN
Chamber C:
etching of poly-Si, poly-SiGe, and


  Deposition of metal and metal alloys films by the sputter process.
Deposition of nitrides by reactive sputtering with N2, e.g. TiN.

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